| 摘要 |
The method for forming the connection terminal of the semiconductor package and semiconductor package are provided to improve the connection reliability of the connection terminal by forming the bump and the outer connector after the reinforcing member is formed. The semiconductor package comprises the semiconductor chip(110) in which the bonding unit is equipped in one side. The first ball land(126a) is arranged on the substrate(120). The first reinforcing member(130) is formed in the opened part of the first ball land. The first reinforcing member is protruded from the lower surface of the substrate. The first ball land is connected to the second ball land(136). The second ball land surrounds the surface of the first reinforcing member. The outer connector(160) is formed on the first and the second ball land. The outer connector is formed in order to surround the first reinforcing member. The semiconductor chip is mounted on the surface of substrate. The electrode terminals to which the bonding units are electrically connected on the substrate are arranged. The lower surface of the substrate is patterned to be electrically connected to electrode terminals. |
