| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive composition having improved adhesiveness, electrical insulation properties, and migration resistance by incorporating an epoxy resin, an acrylonitrile/butadiene rubber, a curing agent, and a migration resistance improver being an alkaline filler. SOLUTION: The alkaline filler used is desirably a filler having a pH of about 9, especially, calcium carbonate. Its amount of use is desirably 5-50 pts.wt. per 100 pts.wt. total of the epoxy resin and the acrylonitrile/butadiene rubber. Although not particularly limited, the curing agent used is desirably an amine curing agent. The adhesive composition is used as an adhesive for a flexible printed circuit board. An example of such circuit board is one prepared by forming a conductor circuit pattern 3 on a base film 1 through a pattern-forming adhesive layer 2 and laminating a cover lay sheet layer 6 on the area on which a circuit pattern part 3 has been formed through an adhesive layer 5.
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