Provided are a flip chip mounter and a mounting method using the same. The flip chip mounter according to one embodiment of the present invention includes a flip head which picks up and flips a chip from a wafer; a transfer head which receives the flipped chip on a transfer module by picking up the flipped chip from the flip head; and a mount head which mounts the received chip on a substrate by picking up the received chip from the transfer module. The transfer head rotates the chip by right and left at a preset angle and mounts the chip on the transfer module.
