| 摘要 |
<p>[PROBLEMS] To form a wiring of a contact hole structure by a simple wet process. [MEANS FOR SOLVING PROBLEMS] On a base surface (2) on which first conductive members (31, 41) are formed, a photosensitive resin obtained by mixing a liquid repellent photosensitive resin or liquid repellent component containing a conductive material is applied to generate a coating film (71). The coating film (71) is patterned by photolithography to form a conducting portion (72) of a contact hole. Thereafter, on the base surface on which the conducting portion (72) of the contact hole and the first conductive members (31, 41) are formed, an insulating material is applied to form an insulating film (8). Finally, second conductive members (32, 33, 42, 43) are formed on the insulating film (8).</p> |
