发明名称 |
Heat-curable polyimide silicone Composition and a cured film therefrom |
摘要 |
A heat-curable resin composition, comprising (A) a polyimide silicone resin having a phenolic hydroxyl group and a radically polymerizable group bonded to a silicon atom, (B) an epoxy resin in such an amount that a molar ratio of the epoxy groups of the epoxy resin to the phenolic hydroxyl groups of the polyimide silicone resin (A) ranges from 0.2 to 10, and a catalytic amount of (C) an organic peroxide.
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申请公布号 |
US2009062479(A1) |
申请公布日期 |
2009.03.05 |
申请号 |
US20080230762 |
申请日期 |
2008.09.04 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
YONEDA YOSHINORI;SUGO MICHIHIRO |
分类号 |
C08L79/08;C08L71/02 |
主分类号 |
C08L79/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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