INSULATING HEAT-TRANSFER STRUCTURE AND SUBSTRATE FOR POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide an insulating heat-transfer structure and a substrate for a power module capable of efficiently transferring the heat on a heating body side to a heat sink side for dispersing heat, and exhibiting stable performance for an extended period even if thermal deformation occurs under such action as temperature cycle. SOLUTION: There are provided an insulator layer 2 and high heat-transfer body layers 3 and 4 arranged on both side of the insulator layer 2. The insulator layer 2 comprises a junction layer 5 and diamond particles 6 projected into the high heat-transfer body layers 3 and 4. The projection area of the diamond particles 6 on the interface between the high heat-transfer body layers 3 and 4 and the insulator layer 2 is 20-60% of the area of the interface. COPYRIGHT: (C)2007,JPO&INPIT