发明名称 |
Sensor module structure and method for fabricating the same |
摘要 |
A sensor module structure and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers is provided, each chip carrier having a first surface and a second surface. At least one semiconductor chip is mounted on and electrically connected to the first surface of each of the chip carriers. An encapsulation body is formed for completely encapsulating the semiconductor chips and the first surfaces of the chip carriers. A singulation process is performed to form individual package units integrated with the semiconductor chips. A sensor chip, a corresponding lens kit and a flexible printed circuit (FPC) board are attached to the second surface of each of the chip carriers, wherein the sensor chip and the FPC board are electrically connected to the chip carrier. This provides the sensor module structure fabricated with simple processes, low costs and high yields.
|
申请公布号 |
US2006223216(A1) |
申请公布日期 |
2006.10.05 |
申请号 |
US20050208269 |
申请日期 |
2005.08.18 |
申请人 |
CHANG CHIN-HUANG;HUANG CHIEN-PING;HUANG CHIH-MING;CHANG CHENG-YI;HSIAO CHENG-HSU |
发明人 |
CHANG CHIN-HUANG;HUANG CHIEN-PING;HUANG CHIH-MING;CHANG CHENG-YI;HSIAO CHENG-HSU |
分类号 |
H01L21/00;H01L21/56;H01L23/495;H01L25/16;H01L27/146 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|