SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

Provided is a substrate processing apparatus by which a maintenance cycle can be lengthened and prevents byproducts from dropping onto a substrate even when the byproducts are accumulated. In one embodiment, the substrate processing apparatus is provided with a processing chamber for processing the substrate by holding the substrate with a substrate holder; a reaction tube which demarcates the processing chamber; a heating apparatus arranged around the reaction tube for heating the processing chamber; and an exhaust tube, which is connected to the reaction tube above the substrate in the processing chamber, extends downward from the heating apparatus by having the extending section separated from the reaction tube and exhausts a gas in the reaction tube.