ADHESIVE COMPOSITION, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER
摘要
<p>An adhesion composition comprising (a) a thermoplastic resin, (b) a radically polymerizable compound having one or more fluorene structure in the molecule, and (c) a radical polymerization initiator.</p>
申请公布号
WO2008015852(A1)
申请公布日期
2008.02.07
申请号
WO2007JP62585
申请日期
2007.06.22
申请人
HITACHI CHEMICAL COMPANY, LTD.;IZAWA, HIROYUKI;SHIRASAKA, TOSHIAKI;KUDOU, SUNAO;TOMIZAWA, KEIKO;KATOGI, SHIGEKI
