| 摘要 |
In a substrate processing apparatus, a control section is preset to perform a chemical liquid process by use of a chemical liquid after a rinsing process by use of a rinsing liquid. The control section first executes a step of rotating a substrate at a rotational speed not lower than that used in the rinsing process and supplying the chemical liquid onto the substrate, thereby performing cleaning inside a drain cup by the chemical liquid, while discarding, through a waste line, liquid received by the drain cup. The control section then executes a step of rotating the substrate at a decreased rotational speed for the chemical liquid process and supplying the chemical liquid onto the substrate, thereby performing the chemical liquid process on the substrate, while collecting, through a collection line, liquid received by the drain cup.
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