发明名称 |
Power distribution system for semiconductor die |
摘要 |
A power distribution system for a semiconductor die includes bonding pads located adjacent to and connected to power busses with connections between the bonding pads providing a parallel path for current. Connections may be provided by stitch bonds, by conductors within a substrate or by other means.
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申请公布号 |
US6025616(A) |
申请公布日期 |
2000.02.15 |
申请号 |
US19970882714 |
申请日期 |
1997.06.25 |
申请人 |
HONEYWELL INC. |
发明人 |
NGUYEN, TOAN DINH;JOHNSON, MICHAEL T. |
分类号 |
G11C5/14;(IPC1-7):H01L29/76;H01L29/94;H01L31/062;H01L31/113 |
主分类号 |
G11C5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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