| 主权项 |
1. Method for making current sensors, the method comprising the following steps executed in the order given below:
A) providing a leadframe having chip supporting surfaces and mounting a semiconductor chip having one or more integrated Hall sensors on each of the chip supporting surfaces of the leadframe, B) connecting electrical connection areas of the semiconductor chips with associated connecting terminals of the leadframe by bonding wires, C) placing the leadframe in an injection mold, D) closing the injection mold with a first mold insert having a molding surface provided with structures, E) injecting plastic material into the injection mold to package each semiconductor chip and associated parts of the leadframe in an associated intermediate casing, wherein the structures of the mold surface of the first mold insert form on each intermediate casing a flat surface having alignment structures, F) opening the injection mold, G) placing a current conductor section on the flat surfaces of the intermediate casings, wherein each current conductor section is formed with counter structures matching the alignment structures, so that the current conductor section is automatically aligned and held, H) closing the injection mold with a second mold insert, I) injecting plastic material into the injection mold to connect the current conductor sections with the associated intermediate casing and form the final housings of the current sensors, J) opening the injection mold and removing the leadframe from the injection mold, and K) singulating the current sensors. |
