| 摘要 |
PURPOSE: A reflow bake system for manufacturing a semiconductor is provided to change the exhaust volume according to the desired pattern profile and to stop a process by generating an alarm in case that the exhaust volume is out of a normal range. CONSTITUTION: A bake plate(2) having a heater removes the moisture and decides the profile of a pattern by transferring the heat to a wafer(1). A bake cover(4) placed on an upper part of the bake plate with a distance has an exhaust hole connecting to the exhaust line. A shield(5) placed to the border of the bake plate isolates the space between the bake cover and the bake plate from the outside. A nitrogen supply line(7) connects to a nitrogen supply hole(500) penetrating the shield. A path controller controls the close/open of the nitrogen supply line according to a process condition. An exhaust pressure detector(10) detects the pressure of the space between the bake cover and the bake plate. A controller operates the alarm by receiving the detection signal from the exhaust pressure detector.
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