| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a pin connecting structure of a printed board which can maintain a good reliability in vibration and heat-cycle environments. <P>SOLUTION: In the pin connecting structure, there is provided a via 7 for connecting a lead terminal 1 inserted into a through-hole 3 with an inner layer 42 present in a printed board 2. Consequently, the connection can be secured even when a joining interface 6a is damaged between the through-hole 3 and the inner layer 42 due to vibrations and heat cycles. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
