ADHESIVE FILM, DICING/DIE-BONDING FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film capable of allowing a high-quality semiconductor device, which is obtained by using the adhesive film, to be produced in high yield and to provide a method for producing the semiconductor device by using the adhesive film and the semiconductor device to be obtained by the method for producing the semiconductor device.SOLUTION: The adhesive film is used for embedding a first semiconductor element 11 fixed on an adherend and fixing a second semiconductor element 12 different from the first semiconductor element to the adherend. The adhesive film exhibits 0.2 MPa or lower tack strength to SUS (stainless steel) at 40°C. The adhesive film, after diced, hardly performs reattachment, consequently can easily be picked up and can embed the first semiconductor element on the adherend.