发明名称 INK-JET PRINT HEAD CHIP, METHOD FOR MANUFACTURING AN INK-JET PRINT HEAD CHIP, STRUCTURE FOR CONNECTING AN INK-JET PRINT HEAD CHIP AND FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR CONNECTING AN INK-JET PRINT HEAD CHIP AND FLEXIBLE PRINTED CIRCUIT BOARD
摘要 An ink-jet print head chip, method for manufacturing the ink-jet print head, structure for connecting the ink-jet print head chip and a flexible printed circuit board and method for connecting the ink-jet print head chip and the flexible printed circuit board are provided to reduce the time required for connecting the ink-jet print head chip to the flexible printed circuit board by simultaneously connecting a plurality of lead lines of the flexible printed circuit board to a plurality of connection pads of the ink-jet print head chip. An ink-jet print head chip(100) comprises a nozzle unit including a plurality of nozzles, a plurality of connection pads(107) and an overflow prevention protrusion(110). The connection pads are installed at a side of the nozzle unit and are electrically connected to a plurality of ink discharging parts, which are formed at a lower part of the nozzle unit. The overflow prevention protrusion is installed between the nozzle unit and the connection pad and has a height higher than that of the connection pad.
申请公布号 KR20080066447(A) 申请公布日期 2008.07.16
申请号 KR20070003920 申请日期 2007.01.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JUNG WOOK;CHO, SEO HYUN
分类号 B41J2/015;B41J2/02 主分类号 B41J2/015
代理机构 代理人
主权项
地址