发明名称 |
INK-JET PRINT HEAD CHIP, METHOD FOR MANUFACTURING AN INK-JET PRINT HEAD CHIP, STRUCTURE FOR CONNECTING AN INK-JET PRINT HEAD CHIP AND FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR CONNECTING AN INK-JET PRINT HEAD CHIP AND FLEXIBLE PRINTED CIRCUIT BOARD |
摘要 |
An ink-jet print head chip, method for manufacturing the ink-jet print head, structure for connecting the ink-jet print head chip and a flexible printed circuit board and method for connecting the ink-jet print head chip and the flexible printed circuit board are provided to reduce the time required for connecting the ink-jet print head chip to the flexible printed circuit board by simultaneously connecting a plurality of lead lines of the flexible printed circuit board to a plurality of connection pads of the ink-jet print head chip. An ink-jet print head chip(100) comprises a nozzle unit including a plurality of nozzles, a plurality of connection pads(107) and an overflow prevention protrusion(110). The connection pads are installed at a side of the nozzle unit and are electrically connected to a plurality of ink discharging parts, which are formed at a lower part of the nozzle unit. The overflow prevention protrusion is installed between the nozzle unit and the connection pad and has a height higher than that of the connection pad.
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申请公布号 |
KR20080066447(A) |
申请公布日期 |
2008.07.16 |
申请号 |
KR20070003920 |
申请日期 |
2007.01.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, JUNG WOOK;CHO, SEO HYUN |
分类号 |
B41J2/015;B41J2/02 |
主分类号 |
B41J2/015 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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