| 摘要 |
Provided is a process for cooling a data center chamber having racks configured to hold arrays of rack-mounted computing devices, the process including: directing a cooling fluid, at a first temperature and a first pressure from an outer radius of circularly arranged racks through the racks and components within the racks; passing the cooling fluid to an interior chamber of the data center chamber at a second temperature and a second pressure; and directing the cooling fluid upward to exit the interior chamber. |
