HEAT SINK, METHOD FOR MAKING THE SAME, AND ELECTRONIC DEVICE HAVING THE SAME

摘要

A heat sink includes a connecting member, a first substrate, a second substrate, and a cooling medium. The connecting member is sandwiched between the first substrate and the second substrate, and defines at least one hole passing through the connecting member. Each hole includes a first end and a second end respectively enclosed by the first substrate and the second substrate to define a cavity. The cooling medium is filled in each cavity.

主权项

1. A method for making a heat sink comprising:
providing a connecting member defining at least one hole passing through the connecting member, each hole comprising a first end and a second end opposite to the first end; providing a first substrate and a second substrate each configured to conduct heat; disposing the connecting member on the first substrate, to cause the first end of each hole to be enclosed by the first substrate; filling each hole with a cooling medium; disposing the second substrate on the connecting member away from the first substrate, to cause the connecting member to be sandwiched between the first substrate and the second substrate, and the second end of each hole to be enclosed thereby forming an enclosed cavity; and pressing the first substrate and the second substrate, with the sandwiched connecting member, to cause the first substrate, the second substrate and the connecting member to be connected to each other.