| 摘要 |
PROBLEM TO BE SOLVED: To provide a robotic hand capable of delivering semiconductor wafers having two conflicting properties such as semiconductor wafers having a relatively thin thickness and a normal thickness thereof, without need of changing components of the robotic hand as occasion demands. SOLUTION: A semiconductor wafer W is held in a non-contact state by a first non-contact holder 40 mounted on one side face 38A of a robotic hand 14. In addition and simultaneously, the semiconductor wafer W is held in a non-contact state by a second non-contact holder 60 mounted on the other side face 38B of the robotic hand 14. COPYRIGHT: (C)2007,JPO&INPIT |
