| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board contriving an improvement in reliability by suppressing the occurrence of cracks of a resin sealing a semiconductor element. SOLUTION: In a flexible printed wiring board, there is formed a rectangular device hole 14 in which a rectangular driver IC 20 to be resin-sealed is arranged, and there is provided an inner lead 15 projecting toward the driver IC 20 from the inner periphery of the device hole 14. In the flexible printed wiring board, four corner parts of the device hole 14 are provided with an alignment lead 16 that is tilted to the inner periphery of the device hole 14 and projected toward the corner parts of the driver IC 20. This alignment lead 16 is a dummy lead that is not connected with the driver IC 20, and provided with a through hole 16a for the recognition of the position of the device hole 14. COPYRIGHT: (C)2008,JPO&INPIT
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