| 摘要 |
Provided is a light emitting module which has excellent heat radiating properties, is easily tested, and can be miniaturized. According to an embodiment of the present invention, the light emitting module comprises: a light emitting structure including a first conductive semiconductor layer, an active layer, and a second semiconductor layer; first and second electrodes electrically connected to the first and second semiconductor layers, respectively; a first connection unit having one side connected to the first electrode; a second connection unit having one side connected to the second electrode; a first solder unit connected to the other side of the first connection unit, and arranged to be extended from the bottom of the first connection unit to at least a part of an outer wall; and a second solder unit connected to the other side of the second connection unit, and arranged to be extended from the bottom of the second connection unit to at least a part of the outer wall. |
