THROUGH-SILICON VIA FORMING PRODUCTION SYSTEM, THROUGH-SILICON VIA FORMING PRODUCTION METHOD, STORAGE MEDIUM, AND PROGRAM

摘要

The through-silicon via (TSV) forming production system according to the present invention includes: X-ray inspection devices (10, 11, 12) that acquire images showing the shape of a through-silicon via (70) formed in a silicon substrate and the state of a plating film in the through-silicon via; a defect pattern determining means (21) that determines the presence/absence of a void defect in the plating film on the basis of the acquired images, and classifies, when detecting the void defect, the void defect to one of a plurality of predetermined defect patterns; a failed treatment specifying means (22) that specifies a failed treatment which has caused the void defect, in accordance with the classified predetermined defect pattern; and a control means (23) that instructs a treatment device performing the failed treatment to perform a change treatment for correcting the failed treatment. The present invention can provide a through-silicon via forming production system that enables in-line non-destructive TSV inspection.