| 摘要 |
PROBLEM TO BE SOLVED: To solve a matter that dielectric strength of a circuit being applied with a high voltage deteriorates in conventional electronic components being coated with an insulation sheet because the coating position of the insulation sheet is shifted, and to provide a heat dissipation plate in which insulation is enhanced without sacrifice of heat dissipation properties. SOLUTION: The heat dissipation plate 10 comprises a metallic substrate 12, and an insulator 14 placed on the substrate 12 wherein the insulator 14 is composed of insulating resin containing inorganic filler having thermal conductivity higher than that of the insulating resin. COPYRIGHT: (C)2006,JPO&NCIPI
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