| 摘要 |
A four directional laser inspection apparatus for detecting lead lifting of a surface mount technology(SMT) soldering inspector is provided to increase an inspection speed without rotation or scan movement of the apparatus. In a surface mount technology soldering inspector, a camera(100) is installed toward a vertical bottom plane where a QFP(Quadra Flat Package) to inspect an imaging optical axis is located. A laser projector includes a laser 1(210), a laser 2(220), a laser 3(230) and a laser 4(240) emitting a slit laser beam to four soldered parts of the QFP chip. A controller controls the on/off and brightness of the slit laser beam of each laser, and corrects images photographed in the camera. A display displays images of a soldered part of the QFP chip photographed through the camera.
|
