摘要 |
PROBLEM TO BE SOLVED: To provide a liquid processing apparatus which efficiently processes a pattern formation surface of a wafer while preventing the diffusion of a chemical atmosphere that may occur during chemical processing.SOLUTION: A liquid processing apparatus 10 comprises: a process fluid nozzle 65 provided above a wafer W and having a discharge port discharging a chemical to the wafer W; a process fluid supply mechanism 70 supplying the chemical to the process fluid nozzle 65; and a cover mechanism 60 covering the wafer W from above when the chemical is discharged to the wafer W by the process fluid nozzle 65. The cover mechanism 60 is vertically driven by a lifting drive mechanism 78 between a falling position where the cover mechanism 60 covers the wafer W from above and a lifted position that is positioned higher than the falling position. Further, the liquid processing apparatus 10 includes a shielding mechanism 30 shielding the wafer W from the cover mechanism 60 between the cover mechanism 60 and the wafer W when the cover mechanism 60 is positioned at the lifted position. |