发明名称 LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To make drilling of high processing positional accuracy possible by appropriately determining and applying correction information even when an inter-shaft distance does not come to integral multiplication of a block width regulated by a standard mark provided on an object to be processed in laser processing of multi-shaft type for performing processing of a plurality of portions set apart from each other by a prescribed distance all at once.SOLUTION: A laser processing device which performs processing by dividing a processing range of an object to be processed by a plurality of laser irradiation systems set apart from each other by a prescribed distance includes: a control part which causes each of standard mark reading parts, provided in every laser irradiation system, to read a standard mark such that regions partially overlap with each other over a region broader than the processing range of the laser irradiation systems corresponding to each of the standard mark reading parts and performs a control so as to process the object to be processed by using correction information obtained by the corresponding standard mark reading part in each of the laser irradiation system.SELECTED DRAWING: Figure 1
申请公布号 JP2016175101(A) 申请公布日期 2016.10.06
申请号 JP20150057093 申请日期 2015.03.20
申请人 VIA MECHANICS LTD 发明人 UENO YASUNOBU;NISHIMURA TOSHIYA;NAKAMURA TAKESHI;WATANABE KAZUO
分类号 B23K26/02;H05K3/00 主分类号 B23K26/02
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