发明名称 |
METHOD OF MANUFACTURING CIRCUIT BOARD, METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To manufacture a circuit board that suppresses damage to an electrode, or to manufacture a light-emitting device that suppresses damage to an electrode.SOLUTION: A method of manufacturing a circuit board or a light-emitting device includes a step of preparing a processing member that includes a circuit and a terminal electrode on a first substrate, a separation layer on the terminal electrode, an adhesive layer on the separation layer, and a second substrate on the adhesive layer, performing cutting processing by using a blade that enables cutting processing by rotation to form a groove part on the processing member, and removing a part of the separation layer, the adhesive layer, and the second substrate so as to expose a part of the terminal electrode.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016208020(A) |
申请公布日期 |
2016.12.08 |
申请号 |
JP20160078047 |
申请日期 |
2016.04.08 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
NISHITO SUKENORI;SAKUISHI TATSUYA |
分类号 |
H05K3/40;G06F3/041;G09F9/00;G09F9/30;H01L21/336;H01L27/32;H01L29/786;H01L51/50;H05B33/06;H05B33/10;H05B33/14;H05K1/02;H05K1/11;H05K3/00 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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