Verfahren zum Bearbeiten eines Halbleitersubstrats und Verfahren zum Bearbeiten eines Halbleiterwafers

摘要

According to various embodiments, a method for processing a semiconductor substrate may include: covering a plurality of die regions of the semiconductor substrate with a metal; forming a plurality of dies from the semiconductor substrate, wherein each die of the plurality of dies is covered with the metal; and, subsequently, annealing the metal covering at least one die of the plurality of dies.