| 摘要 |
The technology disclosed herein includes a dual-molded layer overshoe apparatus comprising a cleat, a sole layer configured to receive the cleat, and an upper layer, wherein the upper is molded to the sole layer and the upper layer has a lower durometer than the sole layer, and wherein the plurality of pin plates are secured between the sole layer and the upper layer. Significant elasticity in the upper layer allows stretch for installation and removal. Reduced elasticity in the sole layer offers greater durability in terms of spike retention and abrasion resistance. In one implementation, the components are assembled in one contiguous, fixed arrangement, wherein the cleat is molded into the sole layer, and the upper layer is then molded to the sole layer. |
