发明名称 RECESSED OHMIC CONTACTS IN A III-N DEVICE
摘要 A device includes a III-N layer having an upper side and a lower side, the lower side being opposite the upper side, and at least one conductive contact on the upper side of the III-N layer, the conductive contact extending into the III-N layer. The conductive contact comprises a top side facing away from the lower side of the III-N layer, and a bottom side facing towards the lower side of the III-N layer. The bottom side includes a first end and a second end opposite the first end, a first side rising from the first end to an intermediate point closer to the top side than the first end, and a second side falling from the intermediate point to the second end further from the top side than the intermediate point.
申请公布号 WO2016100225(A1) 申请公布日期 2016.06.23
申请号 WO2015US65597 申请日期 2015.12.14
申请人 TRANSPHORM INC. 发明人 KIKKAWA, TOSHIHIDE;KIUCHI, KENJI;HOSADA, TSUTOMU;KANAMURA, MASAHITO;MOCHIZUKI, AKITOSHI
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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