| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which improves arrangement efficiency of wiring by forming the wiring under a resin core bump.SOLUTION: A semiconductor device comprises: a first Al pad 12a formed on an IC substrate; first Al wiring 12b formed on the IC substrate and in the same layer with the first Al pad; a passivation film 13 formed on the first Al pad, the first Al wiring and the IC substrate; a first via hole 13a which is formed on the passivation film and located on the first Al pad; a first resin core which is formed on the passivation film at a position overlapping the first Al wiring in planar view; and first metal wiring 25 formed in the first via hole, on the first resin core and on the passivation film. |
