发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste capable of screen-printing and suitable for filling through-holes or via-holes of printed wiring boards, accomplishing high-reliability electric connection and low resistance. SOLUTION: The conductive paste contains, as essential components, metal filler, epoxy resin, imidazoles, organic carboxylic acid compound, and chelating agent. The metal filler also contains, as an essential component, copper powder having a metal coating layer of a melting point of 180°C or less on the surface thereof. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008226726(A) 申请公布日期 2008.09.25
申请号 JP20070065612 申请日期 2007.03.14
申请人 SUMITOMO BAKELITE CO LTD 发明人 OKADA WATARU
分类号 H01B1/22;H01B1/00;H05K1/09 主分类号 H01B1/22
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