MULTILAYER ELECTRONIC COMPONENT MANUFACTURING METHOD

摘要

A ceramic multilayer substrate (1) and a cured first resin layer (20) are compression-bonded with a semicured second resin layer (10) interposed between them. The ceramic multilayer substrate (1) has a first wiring conductor (5) on one major surface thereof. The first resin layer (20) has second wiring conductors (21, 22) on one major surface thereof and a circuit element (16) connected to the second wiring conductor (21) and buried in the first resin layer (20). The second resin layer (10) has a via conductor (11) extending through in the direction of the thickness. By the compression bonding, the first and second conductors (5, 22) are electrically connected through the via conductor (11). The second resin layer (10) is placed on the backside of the circuit element (16), thereby preventing a void from being formed.