| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cutting method which does not has bad influence on a flat collet as a pickup apparatus even when debris is produced in the laser dicing of a semiconductor substrate. <P>SOLUTION: In the cutting method of the semiconductor substrate for cutting the semiconductor substrate into chips by irradiating it with a laser beam along the center line in the width direction of the cutting portion on the cutting schedule line, a recess is formed within the cutting schedule line, and cutting by the laser beam is carried out along the center line in the width direction of the recess. At that time, the depth of the recess is made so that the debris does not project above the substrate surface. Further, the depth of the recess from the substrate surface is made to be≥3.5μm. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
