| 摘要 |
PROBLEM TO BE SOLVED: To provide a magnetron sputtering apparatus which deposits a film by obliquely injecting sputtering particles to a substrate to be coated and can form a film with an excellent film uniformity.SOLUTION: A sputtering apparatus includes: a vacuum chamber 101; a substrate holder 131 which is provided in the vacuum chamber and has a loading surface 131a on which a substrate 130 is loaded; a target holder 104 which holds a target 102; a magnet unit 103 which is disposed on a back surface of the target holder, and has a center magnet 103a extending in one direction and a peripheral magnet 103b which is arranged along the center magnet and extends in one direction; and shielding assembly 103A which is provided between the target holder and the substrate holder and has an opening 113. The sputtering apparatus is such configured that sputtering particles are obliquely injected from the target held by the target holder to the substrate loaded on the loading surface through the opening. Size of the opening on one side 130C in one direction of the substrate loaded on the loading surface is larger than that on the other side 130C. |
