| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic package by which a bonding layer 3 having high reliability can be formed between a base 1 and a frame 2 without repeling glass paste nor leaving thermally decomposed gas of an organic binder in a glass layer (the bonding layer 3) formed by baking when the base 1 and frame 2 are bonded with the glass paste. <P>SOLUTION: The method of manufacturing the ceramic package, by which the base and the frame having a through hole are bonded with the glass paste, is characterized in that the surfaces of the base and frame to be bonded have points of≥1.5 mm in the shortest distance to peripheral edges of the surfaces to be bonded and in including a stage of applying the glass paste to one of the surfaces of the base and frame to be bonded into a stage wherein any point in a coating layer has the shortest distance of≤1.0 mm to a peripheral edge of the coating layer. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
