| 摘要 |
PROBLEM TO BE SOLVED: To provide a dispersion of metallic nanoparticles, which forms a metallic coating film having superior electroconductivity, in other words, having a low specific resistance value when applied onto a substrate and baked, further has low viscosity and is easily handled, particularly the dispersion of metallic copper nanoparticles. SOLUTION: The dispersion of the metallic nanoparticles includes the metallic nanoparticles with an average particle size of 1 to 100 nm, in an amount of 10 to 80 wt.%. In the dispersion, a mass ratio (M/N) of the metal (M) to nitrogen (N) is in a range of 5/1 to 40/1. COPYRIGHT: (C)2008,JPO&INPIT
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