| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can improve heat dissipation capability while ensuring a function of storing an excessive solder.SOLUTION: A semiconductor device 10 comprises: a heat generation part 12 having one surface 12a of a rectangular plane shape; a first metallic member 14 arranged opposite to the one surface of the heat generation part; and a solder 16 sandwiched between the heat generation part and the first metallic member. The first metallic member has an opposite part 40 opposite to the one surface and an annular groove part 42 which surrounds the opposite part. An inner periphery of the groove part has a pair of first side parts opposite to each other in an X direction and a pair of second side parts opposite to each other in a Y direction. Each of the pair of first side parts has a salient which is convex on a farther side in the X direction and the shortest distance between recesses along the X direction is made shorter than a length of the one surface along the X direction. Each of the pair of second side parts has a salient which is convex on a farther side in the Y direction and the shortest distance between recesses along the Y direction is made shorter than a length of the one surface along the Y direction. |
