| 摘要 |
A circuit pattern of a substrate is provided to realize the mass-production of semiconductor products and to obtain a high speed from the semiconductor product by forming a bond finger and a trace like a build-up structure. A circuit pattern of a substrate includes first bond fingers(110) spaced apart from each other at a center portion of a substrate(100), insulators(160) on the first bond fingers, second bond fingers(120) on the insulators, and traces. The traces(140) are used for connecting electrically the first and second bond fingers with a ball out. The circuit pattern further includes a plate for connecting a first trace connected to the first bond finger with a second trace connected to the second bond finger.
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