| 摘要 |
PROBLEM TO BE SOLVED: To prevent occurrence of poor bonding due to "fall down", while solving the problem of "bending" of the inner lead of a lead frame due to multiple pin and narrow pitch.SOLUTION: An inner lead is provided around a die pad, and the inner lead has an electrode terminal and a lead formed thin by half-etching. The lead has a protrusion formed on the back side of a bonding area (A) so as to protrude to the mounting surface side and to prevent the inner lead from falling down, and has a protrusion formed on the back side of other area (B) so as to protrude to the mounting surface side and to prevent the inner lead from bending. |
