发明名称 |
Module Testing Utilizing Wafer Probe Test Equipment |
摘要 |
A module plate is provided for use with a wafer handler and testing mechanism. The module plate has a diameter equivalent to an integrated circuit wafer and a height equivalent to or less than a height of a module lid associated with each module in a plurality of modules associated with the module plate. The module plate has a plurality of cutouts in the module plate that have a width equivalent to a width of the module lid and at least a length equivalent to a length of the module lid. The height of the module plate is such that, when a test head contacts a module base of each module in a plurality of modules, the module lid contacts a chuck on which the module plate resides during testing of the module thereby providing resistance in order to accurately test the module. |
申请公布号 |
US2016363611(A1) |
申请公布日期 |
2016.12.15 |
申请号 |
US201514837140 |
申请日期 |
2015.08.27 |
申请人 |
International Business Machines Corporation |
发明人 |
Eckert Martin;Kunigkeit Eckhard;Trianni Quintino L.;Zoellin Christian |
分类号 |
G01R1/04;G01R31/28 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Armonk NY US |