| 摘要 |
In a power module ( 111 ), a free-wheeling diode ( 1 A), an IGBT ( 1 B), and a capacitor ( 20 ) for smoothing direct current are disposed directly on a surface ( 2 BS) of a conductive heat sink ( 2 B) with through holes ( 2 BH). The rear electrodes of the free wheeling diode ( 1 A), the IGBT ( 1 B), and the capacitor ( 20 ) are bonded to the heat sink ( 2 B) for example with solder, whereby the diode ( 1 A), the IGBT ( 1 B), and the capacitor ( 20 ) are electrically connected with the heat sink ( 2 B). The front electrodes of the diode ( 1 A), the IGBT ( 1 B), and the capacitor ( 20 ) are connected with each other for example by wires ( 7 ). In the heat sink ( 2 B), a cooling medium flows through the through holes ( 2 BH). Such a configuration allows miniaturization of the power module and improves the cooling performance and reliability of the power module. |
