| 摘要 |
The front face of an opening (12) in a first wiring substrate (11) is covered by a transparent substrate (15), a light-receiving face is made to face the opening (12) of the first wiring substrate (11), and an imaging element chip (13) is flip-chip bonded to the rear face side of the first wiring substrate (11). A gap (18) formed between connection terminals (14) between the periphery of the light-receiving face of the imaging element chip (13) and the peripheral edge section of the opening (12) in the first wiring substrate (11) is buried in a first resin, and the entire rear face of the imaging element chip (13) and the rear face side of the first wiring substrate (11) are covered by a second resin (30) (30a). At the front face on this rear face side, an exposed conductive portion substantially parallel with the front face of the transparent substrate (15) is covered with the second resin (30). A second wiring substrate (22) is electrically and mechanically connected to the first wiring substrate (11). |
