发明名称 |
COPPER POWDER AND COPPER PASTE, CONDUCTIVE COATING MATERIAL, AND CONDUCTIVE SHEET USING SAME |
摘要 |
Provided is a copper powder that has an increased number of points of contact between copper powder particles, that ensures excellent conductivity, and that can be suitably used in a conductive paste, an electromagnetic wave shield, or the like. The copper powder is configured from flat plate-shaped copper particles 1 that form a dendritic shape having a linearly grown main trunk and a plurality of branches branching from the main trunk. The main trunk and the branches have an average cross-sectional thickness of more than 1.0 µm but no more than 5.0 µm. The copper powder has a flat plate shape that is configured from a layered structure of one layer or a plurality of stacked layers. The average particle size (D50) is 1.0-100 µm. |
申请公布号 |
WO2016151858(A1) |
申请公布日期 |
2016.09.29 |
申请号 |
WO2015JP59481 |
申请日期 |
2015.03.26 |
申请人 |
SUMITOMO METAL MINING CO., LTD. |
发明人 |
OKADA, Hiroshi;YAMASHITA, Yu |
分类号 |
B22F1/00;C09C1/62;C09D5/24;C09D201/00;C25C5/02;H01B1/00;H01B1/22;H01B5/00 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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