| 发明名称 |
BALL BONDING METAL WIRE BOND WIRES TO METAL PADS |
| 摘要 |
An apparatus, and methods therefor, relates generally to an integrated circuit package. In such an apparatus, a platform substrate has a copper pad. An integrated circuit die is coupled to the platform substrate. A wire bond wire couples a contact of the integrated circuit die and the copper pad. A first end of the wire bond wire is ball bonded with a ball bond for direct contact with an upper surface of the copper pad. A second end of the wire bond wire is stitch bonded with a stitch bond to the contact. |
| 申请公布号 |
US2016329294(A1) |
申请公布日期 |
2016.11.10 |
| 申请号 |
US201514796745 |
申请日期 |
2015.07.10 |
| 申请人 |
Invensas Corporation |
发明人 |
SUBIDO Willmar;CO Reynaldo;ZOHNI Wael;PRABHU Ashok S. |
| 分类号 |
H01L23/00;H01L23/498 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for an integrated circuit package, comprising:
a platform substrate having a copper pad; an integrated circuit die coupled to the platform substrate; a wire bond wire coupling a contact of the integrated circuit die and the copper pad; a first end of the wire bond wire being ball bonded with a ball bond for direct contact with an upper surface of the copper pad; and a second end of the wire bond wire being stitch bonded with a stitch bond to the contact. |
| 地址 |
San Jose CA US |
