| 摘要 |
Provided is a laser machining device (1) that includes: a processing head (4) for irradiating a workpiece (W) with laser light (LL) and processing the workpiece (W); tables (2, 2a-2g) on which the workpiece (W) is carried, and which have at least two marks (3, 3A-3C); drive devices (10, 20) for changing the relative position of the processing head (4) and the tables (2, 2a-2g); a reader device (8) for reading the marks (3, 3A-3C); and a mechanism (4G) for correcting the direction of irradiation of the laser light (LL) using the locations of the marks (3, 3A-3C) obtained through reading out of the marks (3, 3A-3C) by the reader device (8). |
