| 摘要 |
PROBLEM TO BE SOLVED: To reduce stop of a machine caused by a reading error of a positioning mark attached on a transparent substrate as much as possible and to improve operating rates of a chamfering device and other side edge processing devices, in regard to a side edge processing method and device suitable for applying processing, such as grinding and chamfering, to side edges of the transparent substrate for a display panel. SOLUTION: A light source 10, preferably a surface light source for illuminating the transparent substrate 5 from the side opposite to a camera 7 is arranged, and the transparent substrate 5 is illuminated by the light source 10 during mark reading. Conventionally, when an opaque mark 6 on the transparent substrate 5 is read by the camera 7, the transparent substrate 5 is illuminated from the same direction as that of the camera 7 to read the opaque mark 6 by reflected light. In contrast, in this method and device, the back face of the transparent substrate 5 is illuminated by the light source 10 arranged in the side opposite to the camera 7 sandwiching the transparent substrate 5 to read a shadow of the opaque positioning mark 6 by transmitted light. COPYRIGHT: (C)2008,JPO&INPIT
|
