| 摘要 |
The purpose of the present invention is to provide a polishing pad, which has high planarization precision and for which the polishing rate is not susceptible to decrease over a relatively long period. This polishing pad is provided with a substrate film, and a polishing layer that is laminated on the front surface of the substrate film and comprises abrasive grains and a binder therefor. The polishing layer is divided along the polishing direction thereof, and has multiple kinds of regions of differing mean heights. When, in each of said regions, the mean value for the maximum height of the polishing layer in multiple segments that correspond to the distance from the center of gravity of the polishing layer as a whole is the reference height for said region, the difference in reference height for a pair of said regions that are adjacent to each other is 5 µm to less than 100 µm. It is preferable that said multiple kinds of regions are obtained from standard regions and low height regions in which the mean height of the polishing layer is smaller than said standard regions, and are disposed alternately along the polishing direction. It is preferable that the polishing layer has multiple polishing sections of a constant form in planar view that are disposed with roughly equal density. |
