| 发明名称 |
PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARPAGE CONTROL |
| 摘要 |
A package on package structure providing mechanical strength and warpage control includes a first package component coupled to a second package component by a first set of conductive elements. A first polymer-comprising material is arranged between the first package component and the second package component. The first polymer-comprising material surrounds the first set of conductive elements and the second package component. A third package component is coupled to the second package component by a second set of conductive elements. An underfill is arranged on the second package component and surrounds the second set of conductive elements. The first polymer-comprising material extends past sidewalls of the underfill. |
| 申请公布号 |
US2016247782(A1) |
申请公布日期 |
2016.08.25 |
| 申请号 |
US201615143892 |
申请日期 |
2016.05.02 |
| 申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Chen Meng-Tse;Liu Yu-Chih;Huang Hui-Min;Lin Wei-Hung;Lu Jing Ruei;Cheng Ming-Da;Liu Chung-Shi |
| 分类号 |
H01L25/065;H01L23/00;H01L25/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a first package component coupled to a second package component by a first set of conductive elements; a first polymer-comprising material arranged between the first package component and the second package component and surrounding the first set of conductive elements and the second package component; a third package component coupled to the second package component by a second set of conductive elements; and an underfill arranged on the second package component and surrounding the second set of conductive elements, wherein the first polymer-comprising material extends past the sidewalls of the underfill. |
| 地址 |
Hsin-Chu TW |
