发明名称 IGZO devices with reduced threshhold voltage shift and methods for forming the same
摘要 Embodiments described herein provide indium-gallium-zinc oxide (IGZO) devices, such as IGZO thin-film transistors (TFTs), and methods for forming such devices. A substrate is provided. A gate electrode is formed above the substrate. A gate dielectric layer is formed above the gate electrode. An interface layer is formed above the gate dielectric material. An IGZO channel layer is formed above the interface layer. A source electrode and a drain electrode are formed above the IGZO channel layer. The interface layer includes a material different than that of the gate dielectric layer and the IGZO channel layer.
申请公布号 US9082793(B1) 申请公布日期 2015.07.14
申请号 US201314135534 申请日期 2013.12.19
申请人 Intermolecular, Inc. 发明人 Ahmed Khaled
分类号 H01L29/12;H01L29/66;H01L29/786 主分类号 H01L29/12
代理机构 代理人
主权项 1. A method for forming an indium-gallium-zinc oxide (IGZO) device, the method comprising: providing a substrate; forming a gate electrode above the substrate; forming a gate dielectric layer above the gate electrode; forming an interface layer above the gate dielectric material; forming an IGZO channel layer above the interface layer; forming a source electrode above the IGZO channel layer; forming a drain electrode above the IGZO channel layer; and wherein the interface layer comprises a material different than that of the gate dielectric layer and the IGZO channel layer, the material comprising sulfur-doped IGZO.
地址 San Jose CA US